Bluetooth Low Energy SoC Module Brings Fresh Air To the Wireless Market

- Apr 02, 2020-

2.4G low-power wireless transmission control applications began in the millennium and gradually penetrated into all aspects of life. At that time, due to power consumption performance and Bluetooth technology problems, in many markets such as gamepads, remote control racing cars, keyboard and mouse accessories, etc. Private 2.4G applications are mainly used. Until 2011, TI launched the industry’s first Bluetooth low energy chip. Due to the convenience of interoperability with mobile phones, the market for Bluetooth low energy began to explode. It began with wearable applications and gradually penetrated into the traditional 2.4G private protocol market, and expanded to battery-powered wireless transmission applications such as smart furniture and building automation. To this day, the smart wearable is still the largest shipment of all low-power Bluetooth applications, and it is also an area of competition for all Bluetooth chip manufacturers.

Meantime, Dialog presented a new series: DA1458x.

DA1458x series of Bluetooth LE chips have made a big hit on the Xiaomi bracelet with their small size, low power consumption, and high cost-effective products. Since then, dialog has focused on serving the wearable market for many years and has deeply cultivated bracelet brand manufacturers and ODM manufacturers. The Bluetooth chip helps wearable customers simplify system design and quickly achieve product landing. With the outbreak of the IoT market, Dialog actively lays out products other than wearables. The following figure shows the Dialog product planning route for 2018 and 2019. The high-end series can provide dual-core M33 + M0 architecture, integrated power management system PMU, and provide customers with highly integrated SoCs for a wide range of applications such as smart bracelet and smartwatch. The simplified version of the chip is aimed at the fragmented market of the Internet of Things, providing small size, low power BLE penetration modules and COB (chip on board) solutions.

As Mark de Clercq, director of Dialog Semiconductor ’s low-power connectivity business unit, stated in public in early November of 2019, at present, Dialog has shipped 300 million low-power Bluetooth SoCs, and the annual growth rate of shipments is 50%. We have the most extensive Bluetooth low energy SoC and module product portfolio can be optimized for the IoT vertical market. Our newly launched world’s smallest and most powerful Bluetooth 5.1 SoC DA14531 and its module SoC can add Bluetooth low energy connections to the system at a very low cost. And we are not compromising on system performance and size. The size is only half of the existing solution and has global leading performance. This chip will trigger the birth of a new wave of billions of IoT devices.

To make it easier for manufacturers to do further application development, Feasycom integrated the DA14531 into its Bluetooth connectivity solution: FSC-BT690. This model extends the chips’ small-size features at 5.0mm X 5.4mm X 1.2mm, supports Bluetooth 5.1 specifications. By using AT commands, users can enjoy full control of the module easily.

You can learn more about this module from