1.PCB Design instructions
For PCB surface treatment, ENIG (Chemical Ni / Au) and OSP are recommended, and ENIG (Chemical Ni / Au) is preferred.
PCB pad design
In order to achieve high production efficiency and high reliability solder joints, please design according to the recommended PCB pad size in the corresponding product specification.
Even if only part of the pin function of the module is used, it is recommended to do full pad design or symmetrical pad design during PCB Layout, asymmetrical pad design (see figure below) After the solder paste melts, the module is susceptible to being pulled by an unbalanced force. Under the effect of torque, the module deflects, forming a short circuit of the module pin.
In order to ensure the PCB performance of the module and reduce the production defect rate, it is recommended that the customer only reflow the module once. When the PCB is laid out on both sides, the module layout is recommended on the second side of the reflow soldering.
The outermost 1mm area of the corresponding pad of the module avoids the layout of other devices. In order to increase the repair space, the layout of other devices should be as far away as possible from the module body. The minimum distance between the outermost end of the corresponding pad of the module and the edge of the PCB board is 1.5mm.
Module bottom pad design
It is recommended not to design the pads of other electronic component in the module placement area to prevent unpredictable hidden damages.