The Method Of Dealing With Defective Bluetooth Module

- May 14, 2020-

Dealing with bad products

Defective product confirmation

When occurring batch defective product, we strongly recommend the customer not to disassemble the module without confirmation with Feasycom, and keep the site for analysis by the quality engineer to help improve the quality and reduce the production failure rate.

If the customer needs to disassemble the module by himself, please confirm with our sales first, in order to prevent subsequent defective product handling disputes.

When disassembling, please follow the following process:

Rework process description

Regardless of the disassembly or welding process, the temperature rise during the repair process requires ≤3 ° C / sec and the maximum temperature ≤260 ° C. If the module exceeds the storage period before getting repaired, it needs to be baked according to Table 2-1.

Module removal

By heating, the solder is melted and reflowed when the module is removed, and it is necessary to quickly and uniformly provide heat to achieve the simultaneous melting of all solder joints. When removing, avoid heat or machinery damage on the module, PCB, adjacent devices and their solder joint.

It is recommended to use infrared heating or hot air heating for module removal, and infrared heating is preferred. The dedicated fixture is recommended to use in the removal and picking process.

Module welding / replacement

Preparation before welding:

1. Use a soldering iron and a braided material that can wet the solder (such as a solder strip) to remove the old solder on the pad.

2. Clean the pad and remove the flux residue.

3. Solder pre-filling: Before the module is installed on the single board, add solder to the pad in an appropriate way to ensure that the solder paste is molten and then cured to the same height.

4. It is recommended to make jigs and tin-printed steel meshes for rework solder paste printing.

Install the module on the pad accurately to ensure the correct orientation of the module. In order to ensure that the temperature of each part assembled during reflow is the same, it is recommended to preheat the module. After the heat is supplied to the solder, the solder reflows quickly to achieve a reliable connection; the solder joints are maintained at the predetermined temperature for an appropriate reflow time to form a better IMC.

When the module is mounted on the pad after printing tin, it is recommended to use a dedicated jig to pick up.

It is recommended to select or make dedicated repair equipment for repair.